Category:OSWf50ba030bbb743b196e1739fb67d6862
| Abstract KIT Characteristic Category [OSWf50ba030bbb743b196e1739fb67d6862] | |
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| ID | OSWf50ba030bbb743b196e1739fb67d6862 |
| UUID | f50ba030-bbb7-43b1-96e1-739fb67d6862 |
| Label | Abstract KIT Characteristic Category |
| Machine compatible name | AbstractKitCharacteristicCategory |
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Description
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| name | "AbstractKitCharacteristicCategory" |
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| uuid | "f50ba030-bbb7-43b1-96e1-739fb67d6862" | |||||
| title | "AbstractKitCharacteristicCategory" | |||||
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Subcategories
This category has the following 200 subcategories, out of 229 total.
(previous page) (next page)A
- Adhesion (after calendering) (empty)
- Adhesion (after drying) (empty)
- Alignment (empty)
- Alignment (winding/stacking) (empty)
- Applied current (empty)
- Applied current (lab scale) (empty)
- Applied pressure (press rolling) (empty)
- Areal loading (dry) (empty)
- Areal loading (post-dried) (empty)
- Areal loading (wet) (empty)
- Average (dis-)charge voltage (empty)
B
- Band velocity (empty)
- Batch size (mixing) (empty)
- Bending radius (min.) (empty)
- Binder distribution (empty)
C
- Capacity (after formation) (empty)
- Capacity (end of test) (empty)
- Capacity (lab scale) (empty)
- Casting pattern (empty)
- Casting width (empty)
- Cell components (empty)
- Cell components (Lab-scale) (empty)
- Cell type and size (empty)
- Cell type and size (Lab-scale) (empty)
- Cell type and size (large scale) (empty)
- Cell volume variation (empty)
- Chemical purity (empty)
- Composition (empty)
- Composition of electrolyte (empty)
- Conductive additive distribution (empty)
- Conductivity (electrolyte) (empty)
- Configuration (degassing) (empty)
- Configuration (press rolling) (empty)
- Contact alignment (empty)
- Contact duration (empty)
- Contact material (contacting) (empty)
- Contact material pre-treatment (empty)
- Contact material surface quality (empty)
- Contact resistance (empty)
- Contacting equipment (empty)
- Contacting sequence (empty)
- Coulombic efficiency (empty)
- Cycle life (empty)
D
- Density calendered electrode (empty)
- Density dry electrode (empty)
- Distribution electrolyte (empty)
- Dosing accuracy (empty)
- Dosing speed (profile over time) (empty)
- Drying Power (empty)
- Duration (degassing) (empty)
E
- Edge geometry (empty)
- Edge quality (empty)
- Edge quality (lab scale) (empty)
- Electrical charging (empty)
- Electrical conductivity (empty)
- Electrical Insulation (empty)
- Electrochemical testing parameters (empty)
- Electrode placement (empty)
- Electrode placement (lab scale) (empty)
- Electrode wettability (empty)
- Electrolyte volume (empty)
- End of charge voltage (empty)
- End of charge voltage (lab scale) (empty)
- End of discharge voltage (empty)
- End of discharge voltage (lab scale) (empty)
- Energy density (empty)
- Energy efficiency (empty)
- External pressure (formation) (empty)
- External pressure (testing) (empty)
F
- Filling duration (empty)
- Flow rate /dosing volume (empty)
- Foreign particle concentration (empty)
- Formation cycle(s) (empty)
- Formation protocol (empty)
- Formation protocol (lab scale) (empty)
- Fractures in calendered electrode (empty)
- Fractures in dry electrode (empty)
G
- Gap between the rolls (empty)
- Gap between the rolls (calendering) (empty)
- Gap height (empty)
- Gas composition (degassing) (empty)
- Geometry of cut edges (empty)
- Geometry of cut edges (lab scale) (empty)
H
- Hard case: Laser power (empty)
- Hard case: Laser power (pre-sealing) (empty)
- Hard case: Laser power (sealing) (empty)
- Hard case: Laser process (empty)
- Hard case: Laser protocol (sealing) (empty)
- Hard case: Speed (empty)
- Hard case: Speed (pre-sealing) (empty)
- Hard case: Speed (sealing) (empty)
- Heat transfer coefficient dryer (empty)
- Homogeneity (slurry) (empty)
- Homogeneity (wet film) (empty)
- Homogeneity wet film (empty)
- Homogenity of SEI layer (empty)
- Humidity (insertion) (empty)
- Humidity (winding/stacking) (empty)
I
- Insertion alignment (empty)
- Insertion depth (empty)
- Insertion force (empty)
- Insertion parameters (empty)
- Internal pressure (coin cell) (empty)
- Internal pressure (full cell) (empty)
L
- Layer thickness calendered electrode (empty)
- Layer thickness dry electrode (empty)
- Layer thickness wet electrode (empty)
M
- Mass loading (empty)
- Mass loading (negative electrode) (empty)
- Mass loading (positive electrode) (empty)
- Mechanical stability (empty)
- Metallic foreign particles (empty)
- Microstructure deformation (empty)
- Mixing intensity (empty)
- Mixing order (empty)
- Mixing time (empty)
- Mixing tool (model) (empty)
- Mixing tool (serial number) (empty)
- Mixing tool (technology) (empty)
- Mixing tool (vendor) (empty)
- MixingTool (empty)
O
- Order of assembly (empty)
- Overcharge behavior (empty)
- Overdischarge behavior (empty)
P
- Packing density (empty)
- Particle shape (active material) (empty)
- Particle size (active material) (empty)
- Particle size distribution (binder) (empty)
- Polymer phase (empty)
- Pore size distribution (dry film) (empty)
- Porosity calendered electrode (empty)
- Porosity dry electrode (empty)
- Pouch: Duration (empty)
- Pouch: Duration (pre-sealing) (empty)
- Pouch: Pressure (empty)
- Pouch: Pressure (pre-sealing) (empty)
- Pouch: Temperature (empty)
- Pouch: Temperature (pre-sealing) (empty)
- Pouch: Thermal process (empty)
- Pouch: Thermal protocol (empty)
- Pre-activation strategy (empty)
- Pre-sealing pressure (empty)
- Pressure (ultrasonic welding) (empty)
- Pressure of the rolls (empty)
- Pressure of the rolls (calendering) (empty)
- Pressure/compression requirements (empty)
- Purity (electrode slurry) (empty)
- Purity (raw materials) (empty)
R
- Residual moisture (dried film) (empty)
- Residual moisture (post-dried film) (empty)
- Residues sealing seam (empty)
- Rolling speed (press rolling) (empty)
S
- Self-discharge (empty)
- Solid content (empty)
- Solvent loading drying air (empty)
- Speed of the rolls (empty)
- Speed of the rolls (calendering) (empty)
- Stability (empty)
- Stacking: Final weight of stack (empty)
- Stacking: Positioning (empty)
- Surface area (active) (dried film) (empty)
- Surface area (geometrical) (empty)
- Surface quality (empty)
- Surface quality (electrode film wet) (empty)
- Surface roughness (empty)
- Suspension density (empty)
T
- TBD (empty)
- Temperature (contacting) (empty)
- Temperature (degassing) (empty)
- Temperature (drying) (empty)
- Temperature (Electrolyte) (empty)